![[Data] Contracted Analysis Service - Non-destructive Observation](https://image.mono.ipros.com/public/product/image/9eb/2001073044/IPROS96030161848663458997.png?w=280&h=280)
[Data] Contracted Analysis Service - Non-destructive Observation
Effective for identifying defects in semiconductors and electronic components, as well as measuring current distribution in new materials!
This document provides a detailed explanation of the "Contract Analysis Service Non-destructive Observation" conducted by Toshiba Nanoanalysis Corporation. It includes numerous examples such as observing current paths within printed circuit board wiring patterns using a magnetic field microscope, and examining the adhesion of wafer bonding using an ultrasonic microscope (reflection method). Please feel free to consult us when needed. [Contents] ■ Magnetic Field Microscope ■ Ultrasonic Microscope (SAM) ■ 3D X-ray Microscope (X-ray CT) ■ Flow of Contract Analysis Services *For more details, please refer to the PDF document or feel free to contact us.
- Company：東芝ナノアナリシス
- Price：Other
